Protect the SMT components in the back of the PCB board during the wave soldering process
Carry an irregular shape baseboard
Use multi-pak panel design to improve production efficiency
Prevent the deformation of the baseboard during high temperature reflow process
Smooth surface, patience high, can be applied to spray Teflon (Teflon) process
Avoid gold finger contamination by human contact
Protect the SMT components in the back of the PCB board during the wave soldering process
Prevent the deformation of the baseboard during the wave soldering process